Datasheet: https://rocelec.widen.net/view/pdf/65fx6cmlnl/FSCL-S-A0001020796-1.pdf?t.download=true&u=5oefqw
Status: Active
RoHS Compliant: ROHS3 Compliant
Price Quantity: 1
Series: i.MX6
Package: Bulk
Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Grade: –
Qualification: –
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21×21)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Datasheet: http://www.nxp.com/docs/en/data-sheet/IMX6DQAEC.pdf
Status: Not For New Designs
RoHS Compliant: ROHS3 Compliant
Price Quantity: 300
Series: i.MX6Q
Package: Tray
Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Grade: –
Qualification: –
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21×21)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART